Dicing for Semiconductors & Technical Ceramics

Loadpoint - Dicing Equipment Partner

Partnership with Loadpoint Ltd.

GBIT is proud to partner with Loadpoint Ltd., a leader in the design and manufacture of high-precision dicing machines. Known for their exceptional quality, efficiency, and reliability, Loadpoint’s machines are engineered to deliver optimal results for a wide range of applications.

As a market leader in air-bearing spindles with ultra-low vibration performance, Loadpoint continues to innovate on the machinery it pioneered nearly 50 years ago. With a full range of dicing equipment, including semi-automatic and fully automatic single- and twin-spindle options, Loadpoint also offers custom solutions, including vertical spindle configurations tailored to meet specific customer needs worldwide.

NEW ERA OF DICING MACHINES

MicroAce Pro

Semi-automatic dicing saw with a 2.2 kW spindle, customizable for various applications.
Wide application range, including thick substrate cutting.
Advanced features: auto-alignment, auto kerf check, self-adjustment, and fragment shape recognition.
Small footprint for space efficiency.
User-friendly Loadpoint NanoControl system with a 17" LCD touch screen.

NanoAce Pro

12” automatic dicing saw for larger area substrate cutting and dicing.
Vision alignment system and high-resolution linear encoders for precise tolerances in all axes.
Highly configurable to optimize performance for specific applications.
Loadpoint NanoControl system with a user-friendly touchscreen interface.
Customizable NanoControl for complex cut pattern calculations and easy 3D profile generation.

NanoAce Duo Pro

12” semi-automatic dicing saw with two facing spindles for high throughput.
Vision alignment system and high-resolution linear encoders in Y axes for precise tolerances.
Advanced features: auto-alignment, auto kerf check, self-adjustment, and statistical analysis.
Small footprint compared to similar machines.
User-friendly Loadpoint NanoControl system with a 17" LCD touchscreen.

NanoAce Fully Automatic Duo Pro

12” fully automatic dicing saw with two spindles for simultaneous high-throughput dicing.
Vision alignment system and high-resolution linear encoders in Y axes for precise tolerances.
Cost-effective due to rapid dicing speed and full automation.
Advanced features: auto-alignment, auto kerf check, self-adjustment, and statistical analysis.
User-friendly Loadpoint NanoControl system with a 17" LCD touchscreen.

MacroAce Pro

Heavier-duty applications: Designed for high power spindle delivery and large work areas.
Optimized spindle drive: 4kW power delivery in the 1,000 – 10,000rpm range for ceramic and metal cutting.
Cut depth and length: Capable of cuts up to 55mm deep and 450mm long.
Preferred for bulk ceramics and PZT sonar arrays: Ideal for these specific applications.
Loadpoint NanoControl system: Customizable to customer needs, offering advanced cut pattern calculations and 3D profile generation.

Air Bearing Spindles

Loadpoint also supplies a broad range of high-performance, low-vibration air-bearing spindles for applications including dicing, diamond turning, grinding, paint spraying, and rotary tables.

For further information about anything on this page, contact us today.

Page updated

Report abuse